Information by Use

Marking of Sampling Pieces, Marking Lines of Determined Length, Release Location Marking for Measurement Disks, Drawing of Letters/Characters

Use of Tungsten Probes

Lines with intervals of approximately 3μm can be easily drawn

Precise Carved Seals, etc, can be freely created

Excavation of Foreign Substances in Coating Film, Removal of Embedded Foreign Substances, Peeling of Thin Film

Use of Tungsten Probes

Within approximately 15μm of embedded material

Excavating the embedded material

Picking up the embedded material with a probe

Pick up of Powder, Fallen Foreign Substances, and Cut-off Sample Pieces

Vacuum Absorption (Micro Pipette)

5μm Within 5μm of the Micro Pipette

Start of absorption

Release to a KBr disk

Target Object Inside a Microscopic Hole, Adhesives / Grains / Powders / Liquids

Tungsten Probe

Near a microscopic hole with an approximate diameter of 30μm

In contact with one grain of a 5μm target object

Picked up and releases atop a measurement disk

Adhesives / Fallen Foreign Substances / Surface Execution (by scratching or peeling)

Use of Tungsten Probe

Near a strand of hair

In contact with a cuticle

Pick up (8μm)