Application

Cutting of IC Bonding Wires

Use of Micro knives.

Approach to the joint position of gold wire. (About 25 μm thickness)

Touch the base of joint portion.

Cutting completed

Marking of Sampling Pieces, Marking Lines of Determined Length, Release Location Marking for Measurement Disks, Drawing of Letters/Characters

Use of Tungsten Probes

Lines with intervals of approximately 3μm can be easily drawn

Precise Carved Seals, etc, can be freely created

Remove outer layer of Wire　・　Fiber Cross Sectional Cutting　・　Display Surface
※Cutting, Abrasion

Use of Micro knives.

Put on outer layer of wire (700μm)

Cut in "V" shape

Remove the cut portion and display surface

Excavation of Foreign Substances in Coating Film, Removal of Embedded Foreign Substances, Peeling of Thin Film

Use of Tungsten Probes
Use of Micro knives.

Within approximately 15μm of embedded material

Excavating the embedded material

Picking up the embedded material with a probe

Pick up of Powder, Fallen Foreign Substances, and Cut-off Sample Pieces

Vacuum Absorption (Micro Pipette)

5μm Within 5μm of the Micro Pipette

Start of absorption

Release to a KBr disk

Target Object Inside a Microscopic Hole, Adhesives / Grains / Powders / Liquids

Tungsten Probe

Near a microscopic hole with an approximate diameter of 30μm

In contact with one grain of a 5μm target object

Picked up and releases atop a measurement disk

Peeling of Surface 　・　Extracting the Internal Portion of multiple Layer Items　・　Display Surface　　　※Rub, Shave

Use of tungsten probe

Beam to the surface of printing material

Shaving of clear surface and touch the inside ink (Work in about 10 μm area)　

Pick it up (about 5 μm)

Excavation of Foreign Substances in Coating Film　・　Sampling of Embedded Foreign Substances　・　Cutting and Removal of Film　・　Display Surface

Use of Micro knives.

Cut wraped surface film （PCP）

Turn 90 degrees, cut again and remove it.

Transfer to measurement table.

Adhesives / Fallen Foreign Substances / Surface Execution (by scratching or peeling)

Use of Tungsten Probe

Near a strand of hair

In contact with a cuticle

Pick up (8μm)