Microsampling application for semiconductor customers【Micro Support Newsletter Vol.4】

 

Microsampling application

for semiconductor customers

With the growing demand for semiconductors around the world, inquiries and requests from customers related to foreign matter analysis has been increasing recently.
Today, we would like to introduce various applications based on our customer's inquiries.
 

Application

●Clean up fine contamination on a wafer

●Repair of fine wiring(Connection/Disconnection)

●Isolation of defects in LCD/OEL for analysis

●Isolation of defects adhered to substrate for identification

●Isolation of defects from image sensor for analysis

●Isolation of defects on photomask and grating for analysis

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Product

 

 

Application

●Mark around defects on a wafer for SEM

●Mark around FIB location (Preparation before FIB)

●Cut and connect wiring in a circuit

●Scribing substrate for cleavage

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Product

 

 

 

Application

●FIB lift-out

●Replace FIB thin sample and attach outside SEM(Saving chamber time)

●Sampling remotely under special environment  (such as inside a glove box).

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Product

 

 

 

Application

●Relocate diced test piece without damage

●Place small electric component on designated area

●Grab fine wire for adhesion or welding

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Product

 

 

 

Application

●Probing between electrodes on substrate or circuit.

●Contact 1μm width pad with probe

●Measurement for particle of battery material

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Product

 
 
 

Active vibration table

     

If you are interested in these applications, please feel free to contact us or our local distributor.

     

MicroSupport information

 

Catalog request / Micro-handling consultation / Development request / Demo request / Quotation request

Micro Support Co.,Ltd.

1-3-19 Sikiji,Suruga-ku,Shizuoka-City,Shizuoka 422-8036, Japan

Email:info@microsupport.co.jp

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