Microsampling application for semiconductor customers【Micro Support Newsletter Vol.4】
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Microsampling application
for semiconductor customers
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With the growing demand for semiconductors around the world, inquiries and requests from customers related to foreign matter analysis has been increasing recently.
Today, we would like to introduce various applications based on our customer's inquiries.
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Application
●Clean up fine contamination on a wafer
●Repair of fine wiring（Connection/Disconnection）
●Isolation of defects in LCD/OEL for analysis
●Isolation of defects adhered to substrate for identification
●Isolation of defects from image sensor for analysis
●Isolation of defects on photomask and grating for analysis
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Application
●Mark around defects on a wafer for SEM
●Mark around FIB location (Preparation before FIB)
●Cut and connect wiring in a circuit
●Scribing substrate for cleavage
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Application
●FIB lift-out
●Replace FIB thin sample and attach outside SEM(Saving chamber time)
●Sampling remotely under special environment (such as inside a glove box).
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Application
●Relocate diced test piece without damage
●Place small electric component on designated area
●Grab fine wire for adhesion or welding
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Application
●Probing between electrodes on substrate or circuit.
●Contact 1μm width pad with probe
●Measurement for particle of battery material
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If you are interested in these applications, please feel free to contact us or our local distributor.
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Isolation of μm-size particles for FT-IR, Raman and SEM
Resolves an issue related to particulate sampling. Knowledgeable staff will answer.
If you would like to consider the introduction, already your material for those of you can see immediately.
